Browse Prior Art Database

Stacked Surface-Mounted Components

IP.com Disclosure Number: IPCOM000040258D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Budman, M: AUTHOR

Abstract

Surface-mounted components can be used in conjunction with a holder to permit multi-level assembly and greater density on circuit cards or boards. In the figure, printed circuit board 1 has conductor pads 2 that support surface-mounted component 3 on which a second similar component 4 is supported, both via leads 5. A frame 6 has depending conductive bars 7 that selectively connect leads 5 and pads 2, as required. Alignment members 8 retain the superpositioned components. Frame 6 may have ventilation openings above the components to permit cooling. During assembly, an automatic placement machine can be used to position the components and then add frame 6 to align and hold the components. Thereafter, solder reflow connects bars 7, components 3 and 4, and pads 2, where selectively tinned and fluxed.

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Stacked Surface-Mounted Components

Surface-mounted components can be used in conjunction with a holder to permit multi-level assembly and greater density on circuit cards or boards. In the figure, printed circuit board 1 has conductor pads 2 that support surface-mounted component 3 on which a second similar component 4 is supported, both via leads 5. A frame 6 has depending conductive bars 7 that selectively connect leads 5 and pads 2, as required. Alignment members 8 retain the superpositioned components. Frame 6 may have ventilation openings above the components to permit cooling. During assembly, an automatic placement machine can be used to position the components and then add frame 6 to align and hold the components. Thereafter, solder reflow connects bars 7, components 3 and 4, and pads 2, where selectively tinned and fluxed.

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