Browse Prior Art Database

Tcm Assembly: Component Alignment and Pre-Closure

IP.com Disclosure Number: IPCOM000040263D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Feicht, D: AUTHOR [+3]

Abstract

A method for alignment and pre-closure of the components of a circuit module to be encapsulated is described. The components are precisely aligned, then brought together under computer control to form a fixed assembly. The assembly may then be transported to a subsequent operation where the module is compressed and screws inserted. (Image Omitted) The module is comprised of a hat assembly 1 and cooling pistons 2, a lead seal band 3, a ceramic substrate 4, and a baseplate 5. The hat 1 is placed over a bottom plate 6 dedicated to that product type. Four seal band locating blades 7 are extended over the hat surface to form a nest for coarse seal alignment. After the seal band 3 is placed, another set of four blades 8 are extended.

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Tcm Assembly: Component Alignment and Pre-Closure

A method for alignment and pre-closure of the components of a circuit module to be encapsulated is described. The components are precisely aligned, then brought together under computer control to form a fixed assembly. The assembly may then be transported to a subsequent operation where the module is compressed and screws inserted.

(Image Omitted)

The module is comprised of a hat assembly 1 and cooling pistons 2, a lead seal band 3, a ceramic substrate 4, and a baseplate 5. The hat 1 is placed over a bottom plate 6 dedicated to that product type. Four seal band locating blades 7 are extended over the hat surface to form a nest for coarse seal alignment. After the seal band 3 is placed, another set of four blades 8 are extended. The substrate 4, with a temporary template 9 establishing the location of I/O pins, is placed on these blades, I/O pins facing up. After the baseplate 5 is placed, the top fixture plate 10 is positioned over the baseplate 5 and pin array template 9. It is necessary that the substrate pin array be referenced to the template's locating dowels 11 and the datum pins 12 of the baseplate 5. This is done by the top fixture plate 10 as it is lowered over four fixture posts 13 registering the baseplate 5 to the substrate I/O pin array. When the substrate chips 14 contact the cooling pistons 2, the substrate-locating blades 8 may be retracted. Activating a vacuum manifold 15 in the top fixture plate...