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Flexible Manifold System for Supply and Return Connections to an Array of Liquid-Cooled Heat-Transfer Elements in a Circuit Module

IP.com Disclosure Number: IPCOM000040272D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Baron, JG: AUTHOR [+4]

Abstract

Heat-producing semiconductor chips are arranged in a row and column array on the upper surface of a substrate, and each chip is cooled by a liquid-cooled heat-transfer element that rests on the associated chip or is formed as an integral part of the chip, as is shown. Supply and return connections to a cooling liquid system are located at the top of each heat-transfer element. The supply and return connections are coaxial, and the return connection (aribtrarily) is located inside the supply connection. The manifold system has a lower sheet that is formed to connect flexibly to each heat transfer element at the outer supply connection and an upper sheet that connects to each heat transfer element at the inner return connection. The space between the first and second sheets carries supply liquid.

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Flexible Manifold System for Supply and Return Connections to an Array of Liquid-Cooled Heat-Transfer Elements in a Circuit Module

Heat-producing semiconductor chips are arranged in a row and column array on the upper surface of a substrate, and each chip is cooled by a liquid-cooled heat- transfer element that rests on the associated chip or is formed as an integral part of the chip, as is shown. Supply and return connections to a cooling liquid system are located at the top of each heat-transfer element. The supply and return connections are coaxial, and the return connection (aribtrarily) is located inside the supply connection. The manifold system has a lower sheet that is formed to connect flexibly to each heat transfer element at the outer supply connection and an upper sheet that connects to each heat transfer element at the inner return connection. The space between the first and second sheets carries supply liquid. A rigid header plate above the second sheet forms part of the manifold for the return liquid. A third sheet can be provided below the lower sheet to prevent any leaks in the lower sheet from reaching the circuit devices. The curved connections in the two sheets are formed by a drawing process or a plating process. These known techniques provide accurate control of the flexibility of the manifold sheets. This manifold system has the advantage that only a few parts are required, the liquid and vapor barriers are metal, and the resistance to liqu...