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Circuit Module Cooling With Coaxial Bellows Providing Inlet, Outlet and Redundant Connections to Water-Cooled Element

IP.com Disclosure Number: IPCOM000040290D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Antonetti, VW: AUTHOR [+3]

Abstract

Heat-producing semiconductor chips are arranged in a row and column array on the upper surface of a substrate, and each chip is cooled by a water-cooled heat transfer element that contacts the associated chip or has an integral connection to the chip, as is conventional. Supply and return connections to a cooling water system are located at the top of each heat transfer element. A cooling water manifold has an upper return and a lower supply that are separated by a common wall. The (Image Omitted) supply and return connections to the heat transfer element are coaxial, and the return connection is located inside the supply connection and passes through the supply manifold. Each connection includes a bellows to adjust the heat transfer element to the height of its chip.

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Circuit Module Cooling With Coaxial Bellows Providing Inlet, Outlet and Redundant Connections to Water-Cooled Element

Heat-producing semiconductor chips are arranged in a row and column array on the upper surface of a substrate, and each chip is cooled by a water-cooled heat transfer element that contacts the associated chip or has an integral connection to the chip, as is conventional. Supply and return connections to a cooling water system are located at the top of each heat transfer element. A cooling water manifold has an upper return and a lower supply that are separated by a common wall. The

(Image Omitted)

supply and return connections to the heat transfer element are coaxial, and the return connection is located inside the supply connection and passes through the supply manifold. Each connection includes a bellows to adjust the heat transfer element to the height of its chip. The pressure of the cooling water tends to expand the bellows and thereby apply a force to the chip. This force can be limited by giving the bellows only a few deep convolutions or a larger number of shallow convolutions. In the embodiment of Fig. 2, each bellows 2, 3 has shallow convolutions 4 for its full length from the manifolds 5, 6 to the heat transfer element 7. In the embodiment of Fig. 1, each bellows has a few deep convolutions 8 with thin tubular connections 9, 10, 11 to the manifold and to the heat transfer element. The convolutions for the return connection are located i...