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Non-Contact Thermal Radiation Testing of Capacitors And/Or Chips on Multi-Chip Modules or Multi-Level Ceramic Modules

IP.com Disclosure Number: IPCOM000040305D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Prilik, RJ: AUTHOR

Abstract

By means of the addition of infrared (IR) thermography to a normal module test system, individual capacitors and/or chips on modules are checked to determine whether they are emitting thermal radiation within a predetermined, acceptable range. Location and type of thermal radiation failures are determined as part of standard module testing. Referring to the figure, standard module tester 2 interacts with pin selection electronics package 4 to address selected input and output pins of a module, multi-chip module (MCM) or multi-level ceramic (MLC), 6. As is usual, ground plane connection B of module 6 under test is connected to the ground of tester 2. A voltage is normally supplied by supply 8 within tester 2 directly to Vdd input A of module 6 under test.

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Non-Contact Thermal Radiation Testing of Capacitors And/Or Chips on Multi-Chip Modules or Multi-Level Ceramic Modules

By means of the addition of infrared (IR) thermography to a normal module test system, individual capacitors and/or chips on modules are checked to determine whether they are emitting thermal radiation within a predetermined, acceptable range. Location and type of thermal radiation failures are determined as part of standard module testing. Referring to the figure, standard module tester 2 interacts with pin selection electronics package 4 to address selected input and output pins of a module, multi-chip module (MCM) or multi-level ceramic (MLC),
6. As is usual, ground plane connection B of module 6 under test is connected to the ground of tester 2. A voltage is normally supplied by supply 8 within tester 2 directly to Vdd input A of module 6 under test. In this new test system, the voltage from supply 8 goes unaltered to connection A of module 6 through differential amplifier 10 only when function generator 12 is turned off by tester 2 so that normal tests may be performed. When tests for thermal abnormalities are to be performed, tester 2 activates IR thermograph central processor unit (CPU) 14 and controls function generator 12. Infrared optics package 16 provides a thermal image of a portion of module 6 to a detector 18. Signals from detector 18 are processed to determine variations from a stored standard in CPU 14. In addition to sending proc...