Browse Prior Art Database

Electrostatic Discharge Monitor

IP.com Disclosure Number: IPCOM000040310D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Levin, JP: AUTHOR

Abstract

By means of a special shape incorporated in a conductive thin film pattern, electrostatic discharge between conductive regions is confined to known positions. Variation in design of the special shape permits determination of the large potential differences which can occur between conductive regions, for instance, in a process. Process changes aimed at reduction or elimination of destructive arcing between conductive regions are monitored effectively by incorporation of the special shape in monitors or product. In many areas of semiconductor processing, inclusive of mask manufacture, electrostatic discharges cause defects. The incorporation in chrome masks of a shape such as that shown in the figure has been found useful in monitoring process changes made to reduce electrostatic discharge defects.

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Electrostatic Discharge Monitor

By means of a special shape incorporated in a conductive thin film pattern, electrostatic discharge between conductive regions is confined to known positions. Variation in design of the special shape permits determination of the large potential differences which can occur between conductive regions, for instance, in a process. Process changes aimed at reduction or elimination of destructive arcing between conductive regions are monitored effectively by incorporation of the special shape in monitors or product. In many areas of semiconductor processing, inclusive of mask manufacture, electrostatic discharges cause defects. The incorporation in chrome masks of a shape such as that shown in the figure has been found useful in monitoring process changes made to reduce electrostatic discharge defects. Region A in the figure is a portion of a conductive thin film and region B is a portion of another, electrically separate, conductive region. Pointed region C of region A is relatively closer to region B than any other portion of region A. Therefor, any electrical arcing between region A and region B takes place at the pointed region C, where the electric field is highest. Varying the design of the structure, e.g., changing the sharpness of pointed region C or varying spacing between the point of C and region B, varies the potential level causing arcing under given environmental conditions. By applying sufficient measured potential differe...