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Cold Plate for Thermal Conduction Module With Inlet for Cooling Water Near Highest Power Chips

IP.com Disclosure Number: IPCOM000040325D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hwang, UP: AUTHOR

Abstract

A known circuit module has a planar rectangular array of semiconductor chips that are cooled by a cold plate. The cold plate has the same shape as the array of chips, and it is attached to the module with the bottom of the cold plate in thermal contact with the top of the module. Heat is conducted upward from the chips to the cold plate. The cold plate has inlet and outlet connections for chilled water. These connections are commonly located on top of the cold plate at diagonally opposite corners. An improved cold plate has the water inlet connection at the center and the outlet connection at one corner. Inside the cold plate, a rectangularly folded metal barrier strip extends in a spiral from the inlet position to the outlet connection to distribute the water over the floor of the cold plate.

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Cold Plate for Thermal Conduction Module With Inlet for Cooling Water Near Highest Power Chips

A known circuit module has a planar rectangular array of semiconductor chips that are cooled by a cold plate. The cold plate has the same shape as the array of chips, and it is attached to the module with the bottom of the cold plate in thermal contact with the top of the module. Heat is conducted upward from the chips to the cold plate. The cold plate has inlet and outlet connections for chilled water. These connections are commonly located on top of the cold plate at diagonally opposite corners. An improved cold plate has the water inlet connection at the center and the outlet connection at one corner. Inside the cold plate, a rectangularly folded metal barrier strip extends in a spiral from the inlet position to the outlet connection to distribute the water over the floor of the cold plate. The barrier is thermally integral with the floor of the cold plate. Commonly, the center of the chip array has high powered chips that perform logic, and the edges of the array have low powered chips that transfer signals between circuit modules. This cold plate brings the coldest water to the chips that produce the most heat. The channel between the sides of the barrier is wide enough for several parallel fins to extend from the floor of the cold plate. Gaps are provided between fins at bends in the channel. This fin construction provides turbulence which increases heat transfer....