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Novel Seeding Technique for Electroless Metal Plating

IP.com Disclosure Number: IPCOM000040513D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bindra, P: AUTHOR [+5]

Abstract

The surface of suitable substrates (i.e., epoxy/glass) can be modified with nobel metals for improving electroless plating and/or photoresist adhesion. The technique consists of the formation of photoactive deposits of titanium oxide on suitable ambient temperature substrates by treatment with organonitrates followed by a photochemical reduction of palladium ions with this oxide. For an epoxy/glass substrate, the method comprises: a) dipping a cured epoxy/glass composite sample in a tetraisopropyl titanate (TIPT) solution in anhydrous ethanol, b) drying the sample in air to form TiO2, c) redipping the composite into a palladium chloride solution, d) drying this sample in air, and e) irradiating the sample with ultraviolet light.

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Novel Seeding Technique for Electroless Metal Plating

The surface of suitable substrates (i.e., epoxy/glass) can be modified with nobel metals for improving electroless plating and/or photoresist adhesion. The technique consists of the formation of photoactive deposits of titanium oxide on suitable ambient temperature substrates by treatment with organonitrates followed by a photochemical reduction of palladium ions with this oxide. For an epoxy/glass substrate, the method comprises: a) dipping a cured epoxy/glass composite sample in a tetraisopropyl titanate (TIPT) solution in anhydrous

ethanol, b) drying the sample in air to form TiO2,

c) redipping the composite into a palladium chloride

solution, d) drying this sample in air, and

e) irradiating the sample with ultraviolet light. The samples can then be placed in an additive copper bath, resulting in deposition of a uniform, copper layer on the surface which had been irradiated. For use with resists, the epoxy/glass substrate modified with TiO2 from step (b) above can then be coated with resist. The epoxy/glass substrate with resist is then exposed to ultraviolet light and subsequently developed in methyl chloroform (MCF). The substrate is then processed according to steps c), d) and e) above.

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