Browse Prior Art Database

Modules With Miniature Cold Plates Mounted Directly on Chips

IP.com Disclosure Number: IPCOM000040518D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Pennell, GF: AUTHOR [+3]

Abstract

In various modules, e.g., single-chip modules (SCMs), multi-chip modules (MCMs), thermal conduction modules (TCMs), etc., the heat dissipated by the chip must travel through a long thermal passage which is typically divided into two segments: an inner thermal passage from chip to module hat, and an outer thermal passage from the hat to the ambient via a heat sink, or to a fluid via a cold plate. The total thermal resistance (Rt) experienced by the heat dissipated by the chips is broken down into two phases in a similar fashion: an internal thermal resistance, Rint, and an external thermal resistance, Rext . The reduction of Rt(= Rint + Rext) value achieves better junction temperatures on chips and improves their reliability. This is described in the following single step heat transfer process.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 83% of the total text.

Page 1 of 2

Modules With Miniature Cold Plates Mounted Directly on Chips

In various modules, e.g., single-chip modules (SCMs), multi-chip modules (MCMs), thermal conduction modules (TCMs), etc., the heat dissipated by the chip must travel through a long thermal passage which is typically divided into two segments: an inner thermal passage from chip to module hat, and an outer thermal passage from the hat to the ambient via a heat sink, or to a fluid via a cold plate. The total thermal resistance (Rt) experienced by the heat dissipated by the chips is broken down into two phases in a similar fashion: an internal thermal resistance, Rint, and an external thermal resistance, Rext . The reduction of Rt(= Rint + Rext) value achieves better junction temperatures on chips and improves their reliability. This is described in the following single step heat transfer process. For the SCM, MCM, TCM types of applications, an example of a prototype setup is shown in the drawing. A miniature cold plate (MCP) 1 is mounted directly on a chip 2, and a cooling fluid flows through a passage in the MCP 1. The MCP 1 has the same base area as the chip 2 to provide for the greatest contact area for heat transfer. A small spring 3 aligns and holds the MCP 1 in place. The spring 3 is designed to provide sufficient pressure to establish good thermal contact and alignment with the chip. The MCP 1 has several small internal passages (not seen) to allow the cooling fluid to flow and transport the heat aw...