Browse Prior Art Database

Filled Pin Pad Outline

IP.com Disclosure Number: IPCOM000040532D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Williams, WF: AUTHOR

Abstract

Rim voids 1 (Fig. 1) on pin pads of metallized ceramic metal layers 2 on substrates 3 are caused when the screening of a dielectric paste 4 over a substrate pin hole 5 leaves a depression over the hole 5 which the subsequent metallization layer conforms to. This area can become a rim void. The rim voids can be eliminated by filling in the space between dielectric and the substrate with thick film copper paste before the application of the metallization layer. The method works as follows: A ceramic substrate 3 (Fig. 2) is screened with a dielectric paste 4 which defines the tapered hole 5. A copper paste 6 (Fig. 3) is screened around the hole 5, creating a planar surface to accept a uniformly metallized layer 2. This flat surface prevents the formation of rim voids.

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Filled Pin Pad Outline

Rim voids 1 (Fig. 1) on pin pads of metallized ceramic metal layers 2 on substrates 3 are caused when the screening of a dielectric paste 4 over a substrate pin hole 5 leaves a depression over the hole 5 which the subsequent metallization layer conforms to. This area can become a rim void. The rim voids can be eliminated by filling in the space between dielectric and the substrate with thick film copper paste before the application of the metallization layer. The method works as follows: A ceramic substrate 3 (Fig. 2) is screened with a dielectric paste 4 which defines the tapered hole 5. A copper paste 6 (Fig. 3) is screened around the hole 5, creating a planar surface to accept a uniformly metallized layer 2. This flat surface prevents the formation of rim voids.

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