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Method of Improving Metal Adhesion to Polyimide

IP.com Disclosure Number: IPCOM000040547D
Original Publication Date: 1987-Nov-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Albrechta, SM: AUTHOR [+3]

Abstract

A flexible polyimide film chip carrier is personalized with metal electrodes to provide an interconnection between a chip and a substrate. The adhesion of the metal to the polyimide is critical if the interconnection is to be reliable. A method of improving the adhesion is described in the following. A mild alkaline treatment, such as a dilute potassium hydroxide solution, is used to clean the polyimide surface of any residue. This treatment results in a surface which doubles the adhesion between the polyimide and the metal. This treatment is especially important for the adhesion of circuit lines which are less than one mil in width.

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Method of Improving Metal Adhesion to Polyimide

A flexible polyimide film chip carrier is personalized with metal electrodes to provide an interconnection between a chip and a substrate. The adhesion of the metal to the polyimide is critical if the interconnection is to be reliable. A method of improving the adhesion is described in the following. A mild alkaline treatment, such as a dilute potassium hydroxide solution, is used to clean the polyimide surface of any residue. This treatment results in a surface which doubles the adhesion between the polyimide and the metal. This treatment is especially important for the adhesion of circuit lines which are less than one mil in width.

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