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Rectangular Backup Hole for Drop-On-Demand Nozzle

IP.com Disclosure Number: IPCOM000040597D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Kerr, JE: AUTHOR [+2]

Abstract

A low-cost substrate design is described that provides a means for manufacturing closely-packed nozzle arrays for drop-on-demand (DOD) ink jet printers. Nozzle assemblies used in DOD ink jet printheads are formed by an array of nozzles bonded to a rigid substrate having a corresponding array of nozzle backup holes and often utilize etched silicon nozzles bonded to a ceramic substrate. Alignment of the nozzle array with the ceramic substrate is difficult because of the close tolerances involved. Each pyramid-shaped silicon nozzle, typically 14.2 mils square at the nozzle entrance and 2.0 mils square at the nozzle exit, must be centered in the corresponding backup hole. Space must be provided for a fillet formed by an adhesive bond and for differences in part tolerances between the nozzle array and substrate.

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Rectangular Backup Hole for Drop-On-Demand Nozzle

A low-cost substrate design is described that provides a means for manufacturing closely-packed nozzle arrays for drop-on-demand (DOD) ink jet printers. Nozzle assemblies used in DOD ink jet printheads are formed by an array of nozzles bonded to a rigid substrate having a corresponding array of nozzle backup holes and often utilize etched silicon nozzles bonded to a ceramic substrate. Alignment of the nozzle array with the ceramic substrate is difficult because of the close tolerances involved. Each pyramid-shaped silicon nozzle, typically 14.2 mils square at the nozzle entrance and 2.0 mils square at the nozzle exit, must be centered in the corresponding backup hole. Space must be provided for a fillet formed by an adhesive bond and for differences in part tolerances between the nozzle array and substrate. Failure to provide adequate room for the adhesive fillet may lead to flooding of the nozzles, depending on wafer thickness and adhesive properties including bond thickness and wetting characteristics. The round backup holes produced by conventional ceramic forming processes aggravate the tolerance problem because the round holes produced by molding, punching, and drilling operations provide a poor geometric match to the square silicon nozzles. Furthermore, since nozzle arrays are closely packed, both in rows and columns, the wall thickness between holes can create additional problems. The idea described here is...