Browse Prior Art Database

Solder Socket

IP.com Disclosure Number: IPCOM000040609D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Hamel, HC: AUTHOR [+3]

Abstract

Alignment of the optical fiber in an electro-optical chip holder assembly with either the optical source or detector is accomplished by means of the solder socket described in this article. Details of the disclosed solder socket are shown in Fig. 1. The socket assembly comprises a loose fitting pin 1 of approximately 30 mils outer diameter positioned within a hollow tube 2 in the manner shown in the drawing. The tube is approximately 60 mils inner diameter and 120 mils outer diameter, as indicated. The tube is bonded to the electro-optical carrier 3. Molten solder or another suitable conductive fixative, e.g., a conductive epoxy, is employed to obtain a permanent joining of the pin and tube together at the desired time. (Image Omitted) Application of the solder socket proceeds as shown in Fig. 2.

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Solder Socket

Alignment of the optical fiber in an electro-optical chip holder assembly with either the optical source or detector is accomplished by means of the solder socket described in this article. Details of the disclosed solder socket are shown in Fig. 1. The socket assembly comprises a loose fitting pin 1 of approximately 30 mils outer diameter positioned within a hollow tube 2 in the manner shown in the drawing. The tube is approximately 60 mils inner diameter and 120 mils outer diameter, as indicated. The tube is bonded to the electro-optical carrier 3. Molten solder or another suitable conductive fixative, e.g., a conductive epoxy, is employed to obtain a permanent joining of the pin and tube together at the desired time.

(Image Omitted)

Application of the solder socket proceeds as shown in Fig. 2. A positioning tool gripper 4 is used to grip the electro-optical sub- assembly 5 and, while sighting a target structure 6, lens 7, connector ferrule 8 and package female ferrule 9, to establish the assembly in the proper and desired position. This can be done while solder is already in a molten state in the tube (held up by capillary action), or while added following completion of the alignment procedure. The molten solder is allowed to freeze in order to maintain the desired position permanently, after which the positioning tool is removed. If the mechanical connection must also provide an acceptable electrical path, gold epoxy may be employed rather than...