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Ball and Chip Placement Wafer

IP.com Disclosure Number: IPCOM000040615D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Burton, DW: AUTHOR

Abstract

Placement of solder balls used in the interconnection of a ceramic chip and a circuitized substrate require a variety of placement devices and steps for the proper soldering of the chip wiring to the substrate. A flux or wax membrane which holds the solder balls or rings in the precise location for placement on a substrate pinhead eliminates the need for multiple placement operations. The membrane is constructed as seen in the drawing. The membrane is constructed of a material, e.g., wax, flux etc., such that it will dissipate when passed through the heat of a soldering unit when reflowing the solder to bond the solder balls to the circuitized substrate. The solder balls may be of any size and are placed in the desired position on the membrane to align the chip to the substrate.

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Ball and Chip Placement Wafer

Placement of solder balls used in the interconnection of a ceramic chip and a circuitized substrate require a variety of placement devices and steps for the proper soldering of the chip wiring to the substrate. A flux or wax membrane which holds the solder balls or rings in the precise location for placement on a substrate pinhead eliminates the need for multiple placement operations. The membrane is constructed as seen in the drawing. The membrane is constructed of a material, e.g., wax, flux etc., such that it will dissipate when passed through the heat of a soldering unit when reflowing the solder to bond the solder balls to the circuitized substrate. The solder balls may be of any size and are placed in the desired position on the membrane to align the chip to the substrate. The membrane may be cast, molded, or the solder balls or rings may be laminated in the desired pattern to allow the solder balls to be placed as a single unit rather than placing each ball separately. The chip is placed on the membrane in the correct position for attachment to the substrate.

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