Browse Prior Art Database

New Hybrid Packaging Concept for Surface Mount Technology

IP.com Disclosure Number: IPCOM000040621D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Saraiya, MK: AUTHOR

Abstract

A fabricating technique for mounting chips to modules by using tungsten eliminates several wet process steps. The process is described in the following. A ceramic substrate 1 is circuitized on its top surface using tungsten paste screening with tungsten filled vias 2 for its input/output (I/O) connections. Chips 3 are joined to the ceramic circuits (not seen) using controlled collapse chip connector technology involving the melting of solder balls 4. A ceramic cap 5 is hermetically sealed to the substrate 1 to create a module. The sealing may be done using solder seal or able-stick technique. Top seal is not necessary due to the hermeticity of the package. Back seal is also not required.

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New Hybrid Packaging Concept for Surface Mount Technology

A fabricating technique for mounting chips to modules by using tungsten eliminates several wet process steps. The process is described in the following. A ceramic substrate 1 is circuitized on its top surface using tungsten paste screening with tungsten filled vias 2 for its input/output (I/O) connections. Chips 3 are joined to the ceramic circuits (not seen) using controlled collapse chip connector technology involving the melting of solder balls 4. A ceramic cap 5 is hermetically sealed to the substrate 1 to create a module. The sealing may be done using solder seal or able-stick technique. Top seal is not necessary due to the hermeticity of the package. Back seal is also not required. Assembly of the module to a circuit card 6 is done by the standard vapor phase reflow process but with the aid of a chip carrier mounting device (CCMD). The CCMD has solder columns 7 that provide I/O connection from the module to the card 6. The solder columns 7 are in a holder material which is polysulfone foam 8. The foam will wash away during the assembly process.

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