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High-Density Memory Package

IP.com Disclosure Number: IPCOM000040634D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+2]

Abstract

A method of stacking high-density memory chips increases memory in an electronic package without any additional real estate requirements at the card level. The method of constructing the package is described in the following. (Image Omitted) The assembled package, seen in a cross-section view in Fig. 1, consists of a pair of substrates 1 which are placed in a cap 2 such that memory chips 3 face each other. The substrates 1 are joined to the chips 3 before placement in cap 2. The package assembly is complete when a jumper strap 4 is placed around the module and soldered in place. The package is assembled by shearing substrate pins 5 from one of the substrates and inserting the substrate into the cap 2 and securing by crimping (Fig. 2).

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High-Density Memory Package

A method of stacking high-density memory chips increases memory in an electronic package without any additional real estate requirements at the card level. The method of constructing the package is described in the following.

(Image Omitted)

The assembled package, seen in a cross-section view in Fig. 1, consists of a pair of substrates 1 which are placed in a cap 2 such that memory chips 3 face each other. The substrates 1 are joined to the chips 3 before placement in cap 2. The package assembly is complete when a jumper strap 4 is placed around the module and soldered in place. The package is assembled by shearing substrate pins 5 from one of the substrates and inserting the substrate into the cap 2 and securing by crimping (Fig. 2). The substrate is backsealed in the cap 2 while pressure seal is maintained on the other side so that no backseal will enter the package. The backseal is then cured. The other or second substrate is coated with SYLGARD* and is placed into the cap 2 and crimped. The second substrate is now backsealed and cured. The jumper strap 4 (Fig. 3) is attached to make electrical connection between the two package levels. One side of the module is wave soldered to secure the jumper strap 4 to the pins 5. The module is inverted and the other side is wave soldered. The module is now ready for cleaning. A non-conductive coating 6 is applied, and the module is ready for stocking. * Trademark of Dow Chemical Co.

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