Browse Prior Art Database

Circuitization Deletion With an Argon Ion Laser

IP.com Disclosure Number: IPCOM000040654D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Donelon, JJ: AUTHOR [+2]

Abstract

This articles describes a method to remove metal deposited on a surface by covering the metallized surface with a dilute ferric chloride solution and then exposing those parts of the surface where metal is to be removed to an argon ion laser. An example of the use of this concept in microelectronics is removal of copper conductors on the surface of a semiconductor chip or packaging substrate. The circuit to be repaired is covered with a solution of 2.5 g ferric chloride in 1 ml HCl and 1 liter of ethyl alcohol. A concentrated argon ion laser beam is directed on the conductor site to be electrically opened. The laser radiation heats the irradiated zone causing rapid copper etching. The nonirradiated copper conductor etches at a substantially slower rate.

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Circuitization Deletion With an Argon Ion Laser

This articles describes a method to remove metal deposited on a surface by covering the metallized surface with a dilute ferric chloride solution and then exposing those parts of the surface where metal is to be removed to an argon ion laser. An example of the use of this concept in microelectronics is removal of copper conductors on the surface of a semiconductor chip or packaging substrate. The circuit to be repaired is covered with a solution of 2.5 g ferric chloride in 1 ml HCl and 1 liter of ethyl alcohol. A concentrated argon ion laser beam is directed on the conductor site to be electrically opened. The laser radiation heats the irradiated zone causing rapid copper etching. The nonirradiated copper conductor etches at a substantially slower rate. This method effectively etches both copper and an underlying thin chrome adhesion layer.

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