Browse Prior Art Database

Wire Bumping of Metal Surface

IP.com Disclosure Number: IPCOM000040658D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bickford, HR: AUTHOR [+7]

Abstract

This article describes forming metal bumps on a metal surface by first forming balls at the end of wires which are subsequently bonded to the metal surface by thermosonic-wire bonding without the requirement of special processing of the metal surface. The bonded balls are then cut away from the wire and any remaining wire tails can be thereafter pressed down on the pad. An example of the use of this concept in microelectronics is forming gold balls or bumps on a semiconductor chip contact pad for electrical connection to devices and circuits within the chip. Gold- plated metal leads can be effectively thermocompression bonded to such gold balls. This concept is useful either as a primary bumping method or as a contact repair process.

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Wire Bumping of Metal Surface

This article describes forming metal bumps on a metal surface by first forming balls at the end of wires which are subsequently bonded to the metal surface by thermosonic-wire bonding without the requirement of special processing of the metal surface. The bonded balls are then cut away from the wire and any remaining wire tails can be thereafter pressed down on the pad. An example of the use of this concept in microelectronics is forming gold balls or bumps on a semiconductor chip contact pad for electrical connection to devices and circuits within the chip. Gold- plated metal leads can be effectively thermocompression bonded to such gold balls. This concept is useful either as a primary bumping method or as a contact repair process.

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