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Titanium Nitride Adhesion Promoting Metallurgical Barrier

IP.com Disclosure Number: IPCOM000040661D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+4]

Abstract

This article describes the use of titanium nitride as a metallurgical barrier and adhesion promoter between two metal layers between which it is sandwiched. Titanium nitride also imparts substantial impact resistance to such a structure. An example of the use of titanium nitride in microelectronics is for metal contact pads on a semiconductor chip for electrical connection to device and circuit elements within the chip. A contact pad to which a metal lead can be thermocompression bonded consists of a thin titanium nitride layer sandwiched between a top gold or tin layer and a bottom layer of primarily aluminum. The titanium nitride replaces multilayered structures to promote adhesion between the gold or tin and aluminum layers and to inhibit aluminum from diffusing into the gold or tin layer.

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Titanium Nitride Adhesion Promoting Metallurgical Barrier

This article describes the use of titanium nitride as a metallurgical barrier and adhesion promoter between two metal layers between which it is sandwiched. Titanium nitride also imparts substantial impact resistance to such a structure. An example of the use of titanium nitride in microelectronics is for metal contact pads on a semiconductor chip for electrical connection to device and circuit elements within the chip. A contact pad to which a metal lead can be thermocompression bonded consists of a thin titanium nitride layer sandwiched between a top gold or tin layer and a bottom layer of primarily aluminum. The titanium nitride replaces multilayered structures to promote adhesion between the gold or tin and aluminum layers and to inhibit aluminum from diffusing into the gold or tin layer. Such diffusion inhibits effective thermocompression bonding of a gold or tin plated lead to said pad. Titanium nitride is extremely hard and avoids damage to the underlying metallurgy from the impact of thermocompression bonding.

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