Browse Prior Art Database

Improved Component Assembly on Microcircuitry

IP.com Disclosure Number: IPCOM000040711D
Original Publication Date: 1987-Dec-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bakos, P: AUTHOR [+3]

Abstract

A method is disclosed for the protection of exposed edges of copper lines on etched circuit boards for receiving high density surface mount components (SMCs). The method prevents solder ball formation and eliminates shorts that may occur between adjacent lines. The copper exposed by the artwork defining the lines and pads on a printed circuit card for receiving high density SMCs is electroplated with nickel to prevent excessive undercutting of the copper during etching. To enhance module assembly, the edges of the copper circuitry must also be nickel coated. This is done by an immersion technique.The immersion nickel coats the edges of the circuitry and improves reliability.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Improved Component Assembly on Microcircuitry

A method is disclosed for the protection of exposed edges of copper lines on etched circuit boards for receiving high density surface mount components (SMCs). The method prevents solder ball formation and eliminates shorts that may occur between adjacent lines. The copper exposed by the artwork defining the lines and pads on a printed circuit card for receiving high density SMCs is electroplated with nickel to prevent excessive undercutting of the copper during etching. To enhance module assembly, the edges of the copper circuitry must also be nickel coated. This is done by an immersion technique.The immersion nickel coats the edges of the circuitry and improves reliability. The advantages that this method assures are the elimination of copper corrosion through complete coverage of the lines, elimination of shorts between adjacent lines and the subsequent increase in the reliability of the manufactured boards.

1