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Metalized Plastic Enclosure for EMC Shielding

IP.com Disclosure Number: IPCOM000040779D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Karr, PC: AUTHOR [+2]

Abstract

A technique is described whereby methods are provided to fully or selectively metalize plastic enclosures so as to impart highly effective and reliable electro-magnetic compliance (EMC) shielding as well as conductive surfaces for electrical contacts and/or connections.

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Metalized Plastic Enclosure for EMC Shielding

A technique is described whereby methods are provided to fully or selectively metalize plastic enclosures so as to impart highly effective and reliable electro- magnetic compliance (EMC) shielding as well as conductive surfaces for electrical contacts and/or connections.

A plastic film or sheet, compatible with the molding compound to be used to form the enclosure, can be metalized and made conductive on one or both sides by vacuum deposition (vaporization or sputtering), electro/electroless plating foil lamination, rolle or spray coating, etc. The metalization film can be preformed, then placed into the mold, or formed in the mold with the metal clad film against the inside (core) and/or outside (cavity) mold sections in areas required for conductivity/shield- ing. In addition, the metalized film on one side with texture or color on the other can be similarly processed to provide an appearance outer surface to the enclosure.

When the mold is closed, the molten resin is injected to form the enclosure. The molding compound bonds cohesively or adhesively to the preform surface, metalized or unmetalized. Where required, an adhesive or adhesion promoter may be applied to the film surface to be in contact with the molding material prior to molding to enhance adhesion.

The metalization is generally copper for conductivity overlaid with a thin deposition of nickel to furnish low impedance contact, environmental protection an...