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Frequency Controlled Copper Plating

IP.com Disclosure Number: IPCOM000040784D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gall, TP: AUTHOR [+2]

Abstract

Electroplating systems that are current limited have plating rates that vary in relation to the distance from the electrodes. This presents a problem in those applications where sufficient plating is critical and the areas to be plated are remote, e.g., plating of high aspect ratio holes in printed circuit boards. The application of a frequency controlled rate to achieve more uniform plating is described in the following procedure.

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Frequency Controlled Copper Plating

Electroplating systems that are current limited have plating rates that vary in relation to the distance from the electrodes. This presents a problem in those applications where sufficient plating is critical and the areas to be plated are remote, e.g., plating of high aspect ratio holes in printed circuit boards. The application of a frequency controlled rate to achieve more uniform plating is described in the following procedure.

The plating electrodes are wired to an AC generator and the object to be plated. The frequency of the current to be used is determined by the choice and concentration of surfactant. The AC component limits the plating reaction so that it is not current limited and thus achieves a more uniform rate of plating.

Disclosed anonymously

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