Browse Prior Art Database

Low Resistance Plating Paste

IP.com Disclosure Number: IPCOM000040786D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Desai, KS: AUTHOR [+4]

Abstract

This article describes the formulation of a conductive paste with very low resistivity, improved uniformity and increased shelf life.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Low Resistance Plating Paste

This article describes the formulation of a conductive paste with very low resistivity, improved uniformity and increased shelf life.

This paste is used to electrically common ceramic substrate surface features as part of the substrate electroplating process.

The new formulation requires the addition of de-ionized water to the nickel paste, or the addition of de-ionized water and oleoyl sarkosine to the normal nickel paste mixture at nominal concentrations as shown in Table I. Table I WATER OLEOYL RELATIVE COMMENTS ADDED SARKOSYL RESISTANCE none none 6 megohms High Resistance 2.5%
2.5% 38 ohms Low Resistance Good Shelf Life 5%

5% 17 ohms Very Low Resistance & Good Shelf Life

The addition of the water makes the organic binder in the paste more conductive. The addition of the wetting agent (oleoyl sarkosine) makes the paste more screenable, more uniform, and increases its shelf life.

After the screening operation the paste is dried prior to the electroplating process.

Disclosed anonymously

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