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Glycerol Solder Flux

IP.com Disclosure Number: IPCOM000040821D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ainslie, NG: AUTHOR [+5]

Abstract

Glycerol promotes solder reflow at low temperatures of less than 215oC and eliminates the possibility of subsequent corrosion due to chemical reaction.

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Glycerol Solder Flux

Glycerol promotes solder reflow at low temperatures of less than 215oC and eliminates the possibility of subsequent corrosion due to chemical reaction.

Glycerol produces effective solder wetting and clean, strong, defect-free joints for solders containing tin, lead or bismuth in various combinations and proportions and in various atmospheres including hydrogen, forming gas, nitrogen or air. Little or no residue remains after soldering and any residue is removable with warm water.

No chemical activity is provided by glycerol so that the joined parts should be clean. Oxide should be limited to thicknesses that yield to solder expansion during melting. The surface tension of the glycerol assists in physical removal of broken oxide, allowing the liquid solder to wet the base metal or another solder surface.

Disclosed anonymously

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