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Protective Coating for Tungsten Bonding Tips

IP.com Disclosure Number: IPCOM000040822D
Original Publication Date: 1987-Jan-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chalco, PA: AUTHOR [+4]

Abstract

An adherent and effective oxidation-resistant coating for high temperature tungsten bonding tips is provided by depositing onto the tips tungsten silicide having excess silicon to form a better protective oxide layer.

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Protective Coating for Tungsten Bonding Tips

An adherent and effective oxidation-resistant coating for high temperature tungsten bonding tips is provided by depositing onto the tips tungsten silicide having excess silicon to form a better protective oxide layer.

Tungsten bonding tips tend to oxidize and deteriorate rapidly in high temperature environments. The oxidation can be slowed significantly by depositing tungsten silicide over the entire tip surfaces via low pressure chemical vapor deposition. Non-stoichiometric silicide containing excess silicon results in an improved protective coating by providing more silicon for oxidation. This method uniformly covers surfaces having complex contours.

Deposition is accomplished using tungsten hexafluoride and silane or disilane as reactant gases. The ratio of silicon to tungsten is preferably about 2.7 to 1. A higher ratio can be obtained with the disilane, and annealing in an oxygen atmosphere at 700-900oC improves oxidation resistance of the coating even more.

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