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Browse Prior Art Database

Adhesion Measurement Procedure

IP.com Disclosure Number: IPCOM000040830D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Theofrastou, PR: AUTHOR [+4]

Abstract

This article relates to an in-line procedure at the wafer manu facturing level of semiconductor chips for measuring the adhesive strength between two layers of material.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 80% of the total text.

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Adhesion Measurement Procedure

This article relates to an in-line procedure at the wafer manu facturing level of semiconductor chips for measuring the adhesive strength between two layers of material.

An in-line technique, used during the manufacture of semicon- ductor chips, measures the adhesive strength between a substrate and overlaying metal layer and provides accurate yield strength information about the final product.

A pull test fixture, shown in the figure, is solder joined to a set of metal studs at a chip site on a wafer. The mechanical coupling is suitable for an apparatus to perform a pull test which is used to determine the adhesive strength between the metal studs and substrate.

Shown in the figure is a cross-section of the test structure developed. It consists of a substrate carrier 10 on which a semiconductor substrate 11 is mounted. The adhesive strength between metal studs 12 to substrate 11 is the area of interest in the pull test. By employing a single masking procedure, a barrier 13 is diffused into the metal studs which will retard the intermix ing of a solder wetting agent 14, placed on top of the barrier 13, with the underlying metal studs 12. A low melting point solder layer 15 is put on top of the solder wetting agent 14 and a special pull test fixture 16 is placed on top of the test structure. Sufficient thermal energy is applied to the structure to fuse the solder layer 15 to the layers below and to the special pull test fixture 16 on...