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Improved Metal Adhesion to Polyimide

IP.com Disclosure Number: IPCOM000040838D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Skarvinko, EP: AUTHOR [+2]

Abstract

A method of increasing the adhesion of thin film metallurgies, comprising successive layers of chromium (Cr), copper (Cu), and chromium (Cr), to polyimide substrates permits the design of ultra fine line circuitry. The method is described in the following.

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Improved Metal Adhesion to Polyimide

A method of increasing the adhesion of thin film metallurgies, comprising successive layers of chromium (Cr), copper (Cu), and chromium (Cr), to polyimide substrates permits the design of ultra fine line circuitry. The method is described in the following.

The Cr/Cu/Cr layers are deposited on a substrate, typically aluminum foil. The aluminum foil is metallized in a vacuum chamber and the polyimide film is then cast on the metallized aluminum foil surface. The aluminum foil is then etched off leaving the Cr/Cu/Cr layers on the polyimide.

Disclosed anonymously

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