Browse Prior Art Database

High-Temperature Marking Fluid

IP.com Disclosure Number: IPCOM000040840D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Anderson, FW: AUTHOR [+2]

Abstract

Disclosed is a marking fluid which will withstand high tem- peratures and common solvents. The marking fluid is composed of polyimide resins and a solvent. It will resist temperatures on the order of 400oC and hot (100oC) xylene. This is suitable for marking semiconductor integrated circuit dies on the inactive side without having the marking damage the active circuits or affect subsequent processing steps.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

High-Temperature Marking Fluid

Disclosed is a marking fluid which will withstand high tem- peratures and common solvents. The marking fluid is composed of polyimide resins and a solvent. It will resist temperatures on the order of 400oC and hot (100oC) xylene. This is suitable for marking semiconductor integrated circuit dies on the inactive side without having the marking damage the active circuits or affect subsequent processing steps.

The marking fluid is composed of a polyimide resin commonly available from commercial vendors, mixed with N-methyl pyrrolidone as a solvent. Ranges of resin/solvent ratio by weight of 15/85 to 35/65 have been found to be satisfactory. The application method used was by means of a hollow-tube type of pen followed by heat curing at 200oC to 400oC. As the temperature of the cure increases, the degree of solvent resistance increases.

The resultant marking is brown in color and has good visibilit on semiconductor surfaces. For other applications suitable pigments may be added as desired.

Disclosed anonymously

1