Browse Prior Art Database

A Novel Application of Polyimide to Eliminate Decal to Chip Shorting

IP.com Disclosure Number: IPCOM000040848D
Original Publication Date: 1987-Feb-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Back, JA: AUTHOR [+3]

Abstract

In an integrated circuit package in which connections between a semiconductor chip and a packaging substrate are made using metallized lines on a polyimide decal, a problem sometimes occurs due to drooping of the polyimide decal. The drooping at the edge of the semiconductor chip can cause short circuiting of the metallized lines. This problem can be solved by the application of a polyimide coat over the metal lines on the decal where problems are likely to occur. The polyimide coat is then baked to polymerize it to a stable form. After that, the decal is joined to the chip as known in the art and if the decal droops, the metallized lines have been insulated and the problem has been eliminated.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

A Novel Application of Polyimide to Eliminate Decal to Chip Shorting

In an integrated circuit package in which connections between a semiconductor chip and a packaging substrate are made using metallized lines on a polyimide decal, a problem sometimes occurs due to drooping of the polyimide decal. The drooping at the edge of the semiconductor chip can cause short circuiting of the metallized lines. This problem can be solved by the application of a polyimide coat over the metal lines on the decal where problems are likely to occur. The polyimide coat is then baked to polymerize it to a stable form. After that, the decal is joined to the chip as known in the art and if the decal droops, the metallized lines have been insulated and the problem has been eliminated.

Disclosed anonymously

1