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A Contrast Improvement Automated Electronic Card Assembly

IP.com Disclosure Number: IPCOM000040929D
Original Publication Date: 1987-Mar-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Brennemann, AE: AUTHOR

Abstract

Addition of a contrast medium, to a component already present in automated manufacture, facilitates inspection by robot systems.

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A Contrast Improvement Automated Electronic Card Assembly

Addition of a contrast medium, to a component already present in automated manufacture, facilitates inspection by robot systems.

The Figure shows a system to place planar integrated circuit modules on a printed circuit board. The system includes a typical printed circuit board (1), printed circuit wiring (2), a solder mask (3), with openings (4) to the printed circuit wiring, solder paste (5), and the integrated circuit module (6). A typical assembly technique is to align the integrated circuit (6) to its printed circuit wiring (2) pattern while simultaneously viewing the assembly by viewer (7) under visible light lamp (8), using vision information to make positional corrections where necessary. A problem is contrast from the image of the printed circuit board pattern relative to the background lighting as seen by the vision system. Adding UV fluorescent ink to the solder paste (5) and using an ultra-violet lamp (8), provides visible light beams (9) for use in positioning.

This technique improves the image contrast in the regular manufacturing process. The manufacturing steps for placing the components on the board are as follows: (1) The printed circuit wiring pattern, usually copper, is placed on the board by photo-lithography. (2) A polymer solder mask is then placed over the printed circuit board pattern leaving holes in the mask where soldered connections are to be made to the circuits. (3) A solder p...