Browse Prior Art Database

Chip Embedded Tape Automated Bonding (TAB) Process

IP.com Disclosure Number: IPCOM000040933D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lord, PA: AUTHOR

Abstract

Fig. 1 illustrates a low cost high lead count TAB package in which the chip backside is in contact with metal to dissipate heat from the chip and act as a ground plane to control electrical noise.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Chip Embedded Tape Automated Bonding (TAB) Process

Fig. 1 illustrates a low cost high lead count TAB package in which the chip backside is in contact with metal to dissipate heat from the chip and act as a ground plane to control electrical noise.

In Fig. 1, a stainless steel base up to 1 foot wide is used to spin on polyimide or other dielectric materials to which a top circuit layer is added by a fast plating drum technology. This is done in a continuous flow manufacturing process, roll- to-roll. The polyimide can subsequently be etched to hold a semi-conducted chip in a packet as shown in Fig. 1. Sprocket holes are etched at the same time. This permits subsequent manufacturing process controls. Drums can be used to print circuit images onto the surface by fast plating process. This process transfers the resulting metal image e.g., copper, to the top layer of the structure. This process is used for very fine line patterns.

Once the TAB circuits are positioned with cantelever leads over edges of the chip, connection to the chip can be accomplished by known means such as soldering or thermal compressionbond.

Disclosed anonymously

1