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Gasket Assembly for Vacuum Chuck

IP.com Disclosure Number: IPCOM000040945D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Dawson, M: AUTHOR [+2]

Abstract

A modification to a semiconductor wafer mounting tool results an improved vacuum and a reduction in wafer warpage and breakage. The modification involves the use of a rubber gasket at the outer edge of the wafer which enables it to be held securely in the vacuum chuck without undue stress.

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Gasket Assembly for Vacuum Chuck

A modification to a semiconductor wafer mounting tool results an improved vacuum and a reduction in wafer warpage and breakage. The modification involves the use of a rubber gasket at the outer edge of the wafer which enables it to be held securely in the vacuum chuck without undue stress.

In semiconductor processing a wafer mounting tool is used to place the wafer on a taped frame. The tape is ironed to the backside of the wafer by use of a spring loaded roller mechanism. After metallurgy is formed on the wafers it is not uncommon for them to bow or warp. This warpage can lead to breakage of the wafer when it is ironed.

An annular rubber gasket approximately 10 to 15 mils thick is mounted between the chuck and the wafer. This supports the wafer outside the active area and permits the wafer to seal to the vacuum chuck with a minimum of distortion.

Disclosed anonymously

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