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A New Design for a Non-Contact Wafer Scrubber

IP.com Disclosure Number: IPCOM000040953D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Alexander, S: AUTHOR [+2]

Abstract

Collodial gas aphrons (CGAs) are well suited for use in semico ductor manufacturing for non-contact wafer cleaning. The diameter of the CGA bubble (approximately 25 microns) is on the same order as that of circuit dimension which makes it ideal for cleaning.

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A New Design for a Non-Contact Wafer Scrubber

Collodial gas aphrons (CGAs) are well suited for use in semico ductor manufacturing for non-contact wafer cleaning. The diameter of the CGA bubble (approximately 25 microns) is on the same order as that of circuit dimension which makes it ideal for cleaning.

The general requirements for a CGA wafer cleaning system are: (1) a soap solution; (2) a pump; (3) a nitrogen source; and (4) a cleaning chamber. Referring to the figure, a cleaning chamber 10 is provided. Nitrogen gas is introduced through inlet 12. A soap solution 14 is contained within cleaning chamber 10. Pump 16 draws soap solution through tube 18. The CGAs are formed at intersection 20 where the incoming nitrogen meets the soap solution. The CGAs are then pumped through pump 16 to outlet nozzle 22 where they enter the cleaning chamber 10 and interact with wafers 24. After cleaning the wafers, the soap solution is recirculated through the apparatus through tube 18.

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Disclosed anonymously

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