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Thermally Resistive Heat Sink for Operating a Low Power Air Cooled Temperature Sensing Chip to Protect Higher Power Chips by Increasing the Low Power Chips Sensitivity to Air Flow

IP.com Disclosure Number: IPCOM000040965D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Edwards, DL: AUTHOR [+2]

Abstract

One of the lower powered chips on an air cooled circuit card carries a temperature sensor, and the signal from this sensor is used to detect loss of the cooling air flow to all of the chips on the cards on that board. This chip is provided with a heat sink that has low thermal conductivity. So long as the air flow is normal, the chip is adequately cooled and undergoes only a minimal change to the operating temperature. When the low power chip experiences loss of air flow, the chip has a greater temperature excursion than a conventional cooled chip, making loss of air flow easier to detect.

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Thermally Resistive Heat Sink for Operating a Low Power Air Cooled Temperature Sensing Chip to Protect Higher Power Chips by Increasing the Low Power Chips Sensitivity to Air Flow

One of the lower powered chips on an air cooled circuit card carries a temperature sensor, and the signal from this sensor is used to detect loss of the cooling air flow to all of the chips on the cards on that board. This chip is provided with a heat sink that has low thermal conductivity. So long as the air flow is normal, the chip is adequately cooled and undergoes only a minimal change to the operating temperature. When the low power chip experiences loss of air flow, the chip has a greater temperature excursion than a conventional cooled chip, making loss of air flow easier to detect. The new heat sink increases the chip's sensitivity to loss of air flow and enables the chip to better protect the other higher powered chips on the circuit cards that are on the same board that have a strong temperature dependence on airflow. The heat sinks can be manufactured of materials that have more or less heat conductivity, and heat sinks of differing conductivity or physical design can be provided for chips of differing power.

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