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Perfectly Aligned Pole Tips by Using Full Film P2 Process with Al2O3 Protection Layer

IP.com Disclosure Number: IPCOM000040977D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Campbell, RT: AUTHOR [+4]

Abstract

A process is described for producing a magnetic head having pole tips of a selected width which is produced by ion milling.

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This is the abbreviated version, containing approximately 100% of the total text.

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Perfectly Aligned Pole Tips by Using Full Film P2 Process with Al2O3 Protection Layer

A process is described for producing a magnetic head having pole tips of a selected width which is produced by ion milling.

The process is conventional through the deposition on substrate 1 of a shield member 2, a nonmagnetic spacer 3, a first magnetic pole piece 4, various insulation layers 5, and a coil 6. However, the second magnetic pole piece 7 is produced in a first thickness in the pole tip area 8 and a second thickness in the form of a full film extending over the entire area of the magnetic head except for the pole tip area 8. A mask 9 is provided which covers the outline of the second magnetic pole piece 7 except for the pole tip area 8. A thick photo resist mask 10 is provided which covers the second magnetic pole piece in all areas except the back gap area 11 and the pole tip area 8. The wafer is then etched with an Argon ion beam, for example, so that the pole tip area and the back gap area of the head are etched to the desired configuration. The photoresist mask 10 is also etched at the same time but the mask 9 prevents damage to the head during the etching step of the process.

Disclosed anonymously

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