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Gap Filling using High-Temperature Thermoplastics

IP.com Disclosure Number: IPCOM000040987D
Original Publication Date: 1987-Apr-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Chu, MC: AUTHOR [+2]

Abstract

A method for filling the gaps in electronic devices is provide and comprises pump vacuuming the substrate, filling the substrate with a high temperature solventless thermoplastic and laminating the same by applying heat and pressure to the thermoplastic, and cleaning the substrate by mechanical polishing and/or reactive ion etching. These gaps must be filled either to prevent process fluids used in subsequent processes from being collected in the gaps, or provide proper insulation between adjacent structures. The provided method is in contrast to gap filling methods of the art which use solvents and which suffer from shrinkage, void formation, and solvent removal problems.

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Gap Filling using High-Temperature Thermoplastics

A method for filling the gaps in electronic devices is provide and comprises pump vacuuming the substrate, filling the substrate with a high temperature solventless thermoplastic and laminating the same by applying heat and pressure to the thermoplastic, and cleaning the substrate by mechanical polishing and/or reactive ion etching. These gaps must be filled either to prevent process fluids used in subsequent processes from being collected in the gaps, or provide proper insulation between adjacent structures. The provided method is in contrast to gap filling methods of the art which use solvents and which suffer from shrinkage, void formation, and solvent removal problems.

In filling the gaps, the surface of the substrate may be prepared by surface roughening and chemical treatments, if desired, so that adhesion between the thermoplastic and the substrate will be enhanced. The substrate is then preferably vacuum pumped to promote deep penetration of the filling material. The filling material is then melted at a high temperature, and a high pressure is applied so that the gaps are filled and sealed. The high pressure may be applied by a lamination press or by exerting a high gas pressure. Cleaning of the substrate to remove the exess thermoplastic may be achieved by mechanical polishing and/or reactive ion etching.

The particular high-temperature thermoplastic used in the provided method is not critical. However, t...