Browse Prior Art Database

Automatic Tape Backer Removal

IP.com Disclosure Number: IPCOM000040998D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Conru, W: AUTHOR [+3]

Abstract

A high tack tape is used to remove backer or liner material fr double sided tape which has been cut and stuck to a continuous strip workpiece, e.g. lead frames. This backer removal is done just prior to attaching a part (e.g., a semiconductor chip) to the exposed adhesive on the continuous strip workpiece.

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Automatic Tape Backer Removal

A high tack tape is used to remove backer or liner material fr double sided tape which has been cut and stuck to a continuous strip workpiece, e.g. lead frames. This backer removal is done just prior to attaching a part (e.g., a semiconductor chip) to the exposed adhesive on the continuous strip workpiece.

Referring to the figure, continuous strip workpiece 2 has tape segments 4 (with backer material still attached) stuck in place. To remove the backer material, a high tack tape 6 is fed under resilient pressure roller 8 and thus pressed into contact with the backer material 10 which is transferred to, carried away and discarded by tape 6 as workpiece 2 is indexed toward a next assembly station via a sprocket drive in holes 12. Adhesive strength of tape 6 to backer material 10 and of tape 4 to work- piece 2 must be greater than adhesive strength of tape 4 to backer material 10.

Disclosed anonymously

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