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Via Microconnectors

IP.com Disclosure Number: IPCOM000041002D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Dietsch, HE: AUTHOR [+2]

Abstract

Two connectors are described for interconnecting back and fron conductors of a circuit board used in surface mount technology. One type of connector is useful for very small via holes, the other type is employed in larger via holes. Both types are insulated from any conductor internal to the board (e.g., a ground plane) by a plastic sleeve in the via hole.

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Via Microconnectors

Two connectors are described for interconnecting back and fron conductors of a circuit board used in surface mount technology. One type of connector is useful for very small via holes, the other type is employed in larger via holes. Both types are insulated from any conductor internal to the board (e.g., a ground plane) by a plastic sleeve in the via hole.

Fig. 1 shows a cross-section of the connector assembly for very small via holes. Connector 2 is a preformed, tin plated, oxygen free copper (OFC) pin pre- assembled with a teflon insu- lator sleeve 4. This assembly, 2 and 4, is inserted in a drilled hole in the circuit board which is a laminated assembly of front and back conductors 6 and 8 on dielectric layers 10 and 12 which are affixed to a central ground plane 14. The end of pin 2 is flattened as shown by the dashed outline of the end of pin 2 to contact back conductor 6 of the circuit board and to bring the head of pin 2 into good contact with front conductor 8 of the circuit board. Wave soldering completes electrical connection of pin 2 to conductors 6 and 8 of the circuit board. The tin plating on pin 2 assures good solder wetting.

Fig. 2 shows a cross-section of the connector assembly for larger via holes. This connector is comprised of two parts, female part 2f and male part 2m, both of which are tin plated OFC. Teflon insulator sleeve 4 is pre-assembled on female connector part 2f and the assembly, 2f and 4, is inserted in a via ho...