Browse Prior Art Database

High Density I/O Pad Wire Ball Bonding Capillary Tool

IP.com Disclosure Number: IPCOM000041006D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Phelps, DW: AUTHOR

Abstract

A ball thermosonic or thermocompression wire bonding capillary tool for plastic, ceramic or metal packages with high density (I/O) pads being wire bonded in a highly automated environment is reported.

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High Density I/O Pad Wire Ball Bonding Capillary Tool

A ball thermosonic or thermocompression wire bonding capillary tool for plastic, ceramic or metal packages with high density (I/O) pads being wire bonded in a highly automated environment is reported.

Present ball wire bonders are limited to 0.004" square pads on 0.0065" centers minimum due to capillary tool and wire inter- ference problems. When capillary size is reduced, long life requirements for tools used for cut-off or termination bonds 360 degrees from a ball bond site is compromised.

By removing capillary tip material on both sides of the wire feed cavity, as shown in the figure, the tool is capable of bonding in environments where more aggressive I/O pad densities are used without interference. This simple tool modification allows the tool to be installed in a conventional ball bonder with rotating transducer/tool holders and maintain cut-off/ter- mination wire bonding on the capillary tool's front or back tip with the unreduced faces. Bond head rotation for cut-off is reduced to 180 degrees which reduces index time. Increased life of the tool is realized by adding material to the tip in the directions used in cut-off bonding.

The modified capillary ball bonder tip allows more reliable thermosonic or thermocompression ball bonding techniques to be used in environments formerly dominated by ultrasonic bonding by providing wiring interconnections in high density I/O products.

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