Browse Prior Art Database

Passivation of Multilayer Ceramic Capacitors

IP.com Disclosure Number: IPCOM000041014D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Galvagni, J: AUTHOR [+2]

Abstract

Full or partial passivation of the termination contacts on a multilayer ceramic capacitor is provided by the formation of layers of chemical vapor deposited (CVD) glass or sputtered quartz.

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Passivation of Multilayer Ceramic Capacitors

Full or partial passivation of the termination contacts on a multilayer ceramic capacitor is provided by the formation of layers of chemical vapor deposited (CVD) glass or sputtered quartz.

In the fabrication of multilayer ceramic capacitors, con- tacts to the capacitor plates are provided by a series of metal stripes formed on one surface of the capacitor body. An array of solder balls is then formed to provide contact to the device on which the capacitor is mounted. This method passivates or isolates the metal stripes, providing a structure to aid in the formation of the solder balls.

Referring to Fig. 1, a series of metal stripes 1 is formed on a capacitor body 2, e.g., by deposition through a metal mask. The stripes 1 provide contact to selected parallel plates (not shown) in the capacitor body 2. In Fig. 2, a blanket layer 3 of an insulator such as CVD glass or sputtered quartz is formed on the body 2 covering the metal stripes 1. Contact holes 4 in the desired pattern are formed in layer 3 by conventional photolitho- graphy, as shown in Fig. 3. A full "solder dam" is thus provided for the formation of solder balls in the contact holes.

A partial solder dam may be formed as shown in Figs. 4 and 5. The metal stripes 1 are formed as above by deposition through a metal mask 5, shown in Fig. 4. The mask 5 is then shifted so that the metal stripes 1 are covered and the regions between the stripes are uncovered. The CVD...