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Complete Printed Circuit Wafer Probe

IP.com Disclosure Number: IPCOM000041022D
Original Publication Date: 1987-May-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Williams, KH: AUTHOR

Abstract

This disclosure describes a wafer probe capable of contacting all the pads on a wafer at the same time. The ability to contact all pads of a wafer at one time decreases the test time by avoidingmechanical stepping and also results in being able to burn-in at the wafer level.

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This is the abbreviated version, containing approximately 97% of the total text.

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Complete Printed Circuit Wafer Probe

This disclosure describes a wafer probe capable of contacting all the pads on a wafer at the same time. The ability to contact all pads of a wafer at one time decreases the test time by avoidingmechanical stepping and also results in being able to burn-in at the wafer level.

Referring to the figure, the wafer probe 10 is a sandwich structure made from printed circuit boards 12, 14 and 16 which are bonded together. The bottom board 16 has beryllium/copper pads 17 or other equivalent material pads with the same pad pattern as located on a product wafer 18 to be tested.

During final wafer test, product wafer 18 is mounted on dicing frame 20. Vibrating, hot chuck 22 is brought to a tem- perature high enough to make the tin-lead pads 24 on wafer 18 come to a plastic state. The wafer probe 10 is then brought into contact with the wafer pads while the wafer pads are still in their plastic state.

At this point, the heat is turned off and the vibrator can be turned on to scrub away any oxidation or contamination. Testing is accomplished by electronically stepping from one device to another. The probe 10 is connected to a tester via the wiring interconnections on top board 12. The device sorting information is stored in a computer, and while the wafer is in this test position, the devices that are to be fuse blown can be, by applying the correct voltage to the correct pads. After testing, the probe 10 is removed from the product wafer 1...