Browse Prior Art Database

Extension of Surface Mount Multilayer Substrate to Accept Pinned Modules

IP.com Disclosure Number: IPCOM000041063D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Schrottke, G: AUTHOR

Abstract

Present technology exists to accomplish multilayer, high performance substrates and cards, using flex-type materials such as polyimides. These technologies can be used to manufacture cards for electronic assemblies that accept any of the various surface mount packages that are available in the industry. Unfortunately, drilling these cards to accept pin-thru-hole modules cannot be done easily, or destroys the advantage of the multilayer structure.

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Extension of Surface Mount Multilayer Substrate to Accept Pinned Modules

Present technology exists to accomplish multilayer, high performance substrates and cards, using flex-type materials such as polyimides. These technologies can be used to manufacture cards for electronic assemblies that accept any of the various surface mount packages that are available in the industry. Unfortunately, drilling these cards to accept pin-thru-hole modules cannot be done easily, or destroys the advantage of the multilayer structure.

A technique, which is available in the industry, to add a PTH card to the multilayer structure which will accept the PTH modules is shown in Figs. 1-3.

The vias are formed as shown in Figs. 1 and 2. A U-shaped pattern is formed on the polyimide surface of the second layer. It is desired to connect this land to the land area on the first layer. This is done in the present technology by "punching" the tongue through the dielectric layer forming a thermo-compression bond to the first layer metallization. This structure loses its advantage if holes are drilled, which would be required if a PTH module is to be drilled.

To solve the problem the PTH module is mounted using presently known techniques on another card A (see Fig. 3). The multilayer polyimide structure is mounted on card A using compatible adhesive systems. The lines on card A are designed to coincide with the lines on the multilayer surface. The via's patterns are arranged to be over the line...