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Tape Structure for Outer Lead Bonding by a Steady-State Thermode

IP.com Disclosure Number: IPCOM000041064D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Nguyen, DQ: AUTHOR

Abstract

With the use of a steady-state thermode, cleaning of the thermode will not be needed; also, the temperature variation across the thermode head and the soldering time will be reduced.

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Tape Structure for Outer Lead Bonding by a Steady-State Thermode

With the use of a steady-state thermode, cleaning of the thermode will not be needed; also, the temperature variation across the thermode head and the soldering time will be reduced.

The original tape structure for Tape Automated bonding (TAB) is shown in Fig. 1. In this design, the metal outer leads 1 are soldered to the board by a pulse thermode 2.

The new structure for TAB is shown in Fig. 2. The additional feature includes a layer of polyimide on top of the metal outer leads 3. This permits the outer leads to be soldered to the board by a steady-state thermode 4. The steady- state thermode will heat through the polyimide film and melt the solder.

The tape structure and the use of a steady-state thermode gives several advantages:

1. Cleaning of the thermode will not be needed.

2. The temperature variation across the thermode surface is reduced.

3. The soldering time is also reduced due to non-pulsing of the thermode.

Disclosed anonymously.

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