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Browse Prior Art Database

Thermocouple Wafer Slip Eliminator

IP.com Disclosure Number: IPCOM000041073D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hebert, LA: AUTHOR [+2]

Abstract

The thermocouple wafer slip eliminator is a device which can prevent a thermocouple test wafer from slipping as it moves through an oven on conveyor belts. This allows more accurate and repeatable oven temperature profiles upon which oven performance can be evaluated.

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Thermocouple Wafer Slip Eliminator

The thermocouple wafer slip eliminator is a device which can prevent a thermocouple test wafer from slipping as it moves through an oven on conveyor belts. This allows more accurate and repeatable oven temperature profiles upon which oven performance can be evaluated.

Referring to the figure, the temperature profile of an oven is normally evaluated with the use of a test wafer 10 upon which a thermocouple 12 is attached. Thermocouple wire 14 is attached to the thermocouple 12 at one end and to the electronics (not shown) at the other end. This test wafer 10 with thermocouple 12 attached is then conveyed through the oven on belts 16. A temperature profile for the oven can be obtained in this method.

A problem which often occurs is that the wafer 10 slips as a result of drag induced by the thermocouple wire 14. This results in a temperature measurement which does not reflect the actual thermal performance of the silicon wafers in the oven. The thermocouple wire slip eliminator 18 is a device which has two "V" shaped notches 20 which attach to the belts 16. Wire 22 and tape 24 secure the thermocouple wafer slip eliminator 18 to the wafer 10. As the thermocouple wafer slip eliminator 18 travels through the oven on belts 16, it will pull the wafer 10 behind it, thereby overcoming any drag induced slippage caused by the thermocouple wire 14.

Disclosed anonymously.

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