Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Air Bearing Module Track

IP.com Disclosure Number: IPCOM000041075D
Original Publication Date: 1987-Jun-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Wagner, JW: AUTHOR [+2]

Abstract

This article describes an improved air bearing module track which can be used to transport semiconductor modules, or other objects during processing. The module track relies on air foil principles to provide lift and forward motion of semiconductor modules.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Air Bearing Module Track

This article describes an improved air bearing module track which can be used to transport semiconductor modules, or other objects during processing. The module track relies on air foil principles to provide lift and forward motion of semiconductor modules.

Referring to the figure, the air bearing module track 10 consists of three parts, two manifolds 12 and 14 and a flat rectangular riding block 16. The two manifold blocks 12, 14 contain an air supply cavity 18 that forms a manifold area. Manifold areas 18 are connected to a plurality of air veins 20 which are spaced 45 degrees from the line of travel of module 22 indicated by arrow 24. The two manifolds 12, 14 are fastened to the rectangular block 16 to provide a manifold seal. Air supply entering through hose 26 enters the manifold areas 18 and supplies a constant control flow to veins 20 where the air is formed into a plurality of air streams throughout the track.

When a module 22 is present, the air streams cause an air lift to lift the module off the block 16 and also provide directional motion to the module, thereby propelling it along the track.

Disclosed anonymously.

1