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Browse Prior Art Database

Lift-off Process

IP.com Disclosure Number: IPCOM000041092D
Original Publication Date: 1987-Jul-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Agnihotri, RK: AUTHOR [+3]

Abstract

The lift-off process for the manufacture of thin film heads includes a chlorobenzene soak. The substrate is then soaked in an aliphatic or aromatic hydrocarbon solution. The photoresist in the metallurgy or oxide layers did not bubble as a result of a post-bake process.

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Lift-off Process

The lift-off process for the manufacture of thin film heads includes a chlorobenzene soak. The substrate is then soaked in an aliphatic or aromatic hydrocarbon solution. The photoresist in the metallurgy or oxide layers did not bubble as a result of a post-bake process.

A lift-off technique is often required for certain metallization steps in the manufacture of a thin film magnetic head. The photoresist process requires a post-baking to harden the photoresist, before a chemical etch. This additional step of baking can cause the photoresist to bubble.

No bubbling occurred if the photoresist bake process was preceded by a chlorobenzene soak and then a rinse in an aliphatic or aromatic hydrocarbon solution. Solutions, such as heptane, hexane, xylene and cyclohexane, are examples of the hydrocarbon solutions used in place of a standard fluorocarbon soaking solution.

Disclosed anonymously.

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