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An Engineering Change Method for Dual-Sided, Surface Mount Printed Circuit Cards

IP.com Disclosure Number: IPCOM000041097D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Perkins, CT: AUTHOR

Abstract

A method is described for connecting component leads 10 and 11 on opposite sides of a dual-sided, surface mount printed circuit card 12 with discrete wires as shown in Fig. 1.

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An Engineering Change Method for Dual-Sided, Surface Mount Printed Circuit Cards

A method is described for connecting component leads 10 and 11 on opposite sides of a dual-sided, surface mount printed circuit card 12 with discrete wires as shown in Fig. 1.

In accordance with the new method, the original design of the printed circuit card provides groups of unused plated-through-holes 14 (PTH, or via), to allow for future engineering changes.

To connect lead 10 of a component 16 on one surface to lead 11 of a component 17 on the opposite surface, a discrete wire 18 is soldered to the component lead 10 and into one end of an unused PTH 16 on the bottom surface. Another discrete wire 19 is then soldered into the opposite end of the PTH 14 and to the other component lead 11 on the top surface.

Disclosed anonymously.

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