Browse Prior Art Database

200mm Vacuum Tip

IP.com Disclosure Number: IPCOM000041117D
Original Publication Date: 1987-Aug-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kopecky, HR: AUTHOR [+2]

Abstract

A vacuum pencil tip has been developed which can conveniently pick up the increased weight of 200 mm wafers used in semiconductor devices.

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This is the abbreviated version, containing approximately 100% of the total text.

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200mm Vacuum Tip

A vacuum pencil tip has been developed which can conveniently pick up the increased weight of 200 mm wafers used in semiconductor devices.

Fig. 1 depicts the plastic tip which has a step 2. The tip comes in two configurations; one in plastic and one in stainless steel. The stainless steel tip does not have the step.

The purpose of the step in the plastic tip is to compensate for any bulging which may occur when a shaft is inserted into the vacuum port 3. Such a bulge would affect the smooth contour of the tip and affect the vacuum. The horizontal opening 4 in the tip 1 has a greater area than that in conventional tips. This makes it possible to pick up the added weight of the large 200 mm wafer.

The availability of a stainless steel tip 1 means it is possible to lift a hot wafer without waiting for it to cool. Not having to wait for a cool-down has a positive effect on productivity.

Disclosed anonymously.

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