Browse Prior Art Database

Continuous In-Line Sputter Etch/Evaporative Deposition System

IP.com Disclosure Number: IPCOM000041131D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Brown, WW: AUTHOR [+4]

Abstract

A system is described for etching semiconductor wafers and depositing thin film metals in which wafers are transferred automatically between processing stations in a vacuum.

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This is the abbreviated version, containing approximately 58% of the total text.

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Continuous In-Line Sputter Etch/Evaporative Deposition System

A system is described for etching semiconductor wafers and depositing thin film metals in which wafers are transferred automatically between processing stations in a vacuum.

In the processing of semiconductor integrated circuit devices, various operations are performed in a vacuum. Low production rates and contamination may occur when the wafers are transferred from one station to another since the vacuum has to be broken.

In the present system, sputter etching, evaporative deposition and cooling are performed in separate but connected chambers. Wafers are transferred from one chamber to another without having to break the vacuum. The system, schematically shown in the drawing figure, includes an etching chamber 10 into which wafers to be processed are loaded, an evaporative deposition chamber 12, and a cooling chamber 14 from which wafers are unloaded. Chamber 12 has a lower section 16 in which the deposition source 18 is mounted. Suitable means such as an electron beam gun may be used to heat source 18. The main chambers 10, 12, 14 are connected by vacuum valves 20, as is the lower section 16 of chamber 12. The valve 20 between the upper and lower 16 sections of chamber 12 is used to isolate lower section 16 for maintenance or repair of source 18 without breaking the vacuum of the upper section. A monitor 22 in chamber 12 is used to control the rate of deposition and to indicate when a film of the de...