Browse Prior Art Database

Ultra Fast Etchant for Gold, Copper And Silver Films

IP.com Disclosure Number: IPCOM000041140D
Original Publication Date: 1987-Sep-01
Included in the Prior Art Database: 2005-Feb-02
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Brady, MJ: AUTHOR [+4]

Abstract

This article relates generally to selective etching processes for metal and more particularly relates to a method for etching sputtered or evaporated films of gold, copper and silver.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Ultra Fast Etchant for Gold, Copper And Silver Films

This article relates generally to selective etching processes for metal and more particularly relates to a method for etching sputtered or evaporated films of gold, copper and silver.

After a sputtered or evaporated film of copper, gold or silver is prepared, it may be suitably masked for a subsequent +etching step. An etching solution (~ 50%) of Iodine (I2) in N-methyl pyrrolidone (NMP) is prepared. The evaporated or sputtered film of copper, gold or silver is then exposed at ambient for 10-15 seconds to a spray or solution of the above etchant to remove one micron of the film. The remaining material is then rinsed in a suitable solvent such as methanol hydroxide (MeOH).

The above described process is extremely fast and is selective in that it doesn't attack other metals such as palladium, chromium, aluminum, etc. In addition, no alkali metal residues are left on the substrate surfaces.

Disclosed anonymously.

1